[tabby title=”IS-B-460 S”]
PCB`s up to 460x460mm
InterSelect PhotoScan Editor
Windows PC with swiveling TFT Monitor
Customer-friendly process visualization
Remote maintenance and network capability
Pump unit and solder bath made of titanium
Maintenance-free micro drop jet fluxer
Fast and accurate positioning X, Y, Z Axis system
Full-surface (460x460mm) and adjustable IR – preheating from bottom and topside
Lowest energy costs only 1,3 sqm N2 consumption per hour
[tabby title=”Technical Details”]
Footprint:1268 x 1430 x 1560mm (LxBxH)
PCB holder: Length min.max. 5-335mm
Width min.max. 5-335mm
Components above up to 120mm
Components below up to 40mm
Max weight 15 KG
Energy 3 x 400V
1,3 m³/h N2 bei 99,99%
3 bar compressed air
Preheating IR Heater from 1,5 up to 4,5 KW above
IR Heater from 1,5 up to 4,5 KW below
Solder pot 12 KG
Pump unit made of titanium
Pot made of titanium
Process-Camera – The live video of the process camera, which shows the nozzle and the soldering process, is displayed on an additional monitor. By viewing the video the solder wave can be constantly observed by the user – including the whole soldering process. This allows the technician or engineer to adjust the soldering program and important parameters and to observe the result directly on the monitor.
Wave height control and automatic correction – By using a laser sensor the height of the solder wave is monitored – and if necessary automatically corrected to the pre-set wave height.
Solder Level-Sensor – A floater which is monitored by a laser sensor checks on the solder level. When the solder level drops beyond a predetermined level the system displays a message right in the machine’s software.
Pump-System – In order to equalize the flow behavior of the solder in the pump channel and to keep it free of fluctuations this all-titanium pump was constructed in a special procedure. A particularly quiet, turbulent-free solder wave is the result.
Pull-Off Feature to avoid Shorts – Especially when soldering connector strips, or other components where multiple pins can be soldered in a line, shorts can be formed between the last two pins. Excess solder from the last pin cannot be dragged to another pin and forms a bulbous solder joint, or worse: a bridge to the nearby pin. To remove this excess solder the InterSelect systems provide a “pull-off” solution. Before the solder wave is moved away from the solder joint, the machine reduces the pump power abruptly. Due to the rapid collapse of the solder wave, excess solder is withdrawn from the pin and only the required amount of solder remains at solder joint.
Wettable-Nozzles – For the wettable nozzles the solder is running in all directions, i.e. all around the nozzle. Solder nozzles from InterSelect are made from a specially developed metal alloy which have high and persistent resistance even for lead-free solder alloys. A specially designed nozzle body reduces the formation of dross (solder slag) by more than 90% and avoids solder balls on the PCB bottom side far better than conventional nozzle designs.
Remote Maintenance – All InterSelect soldering machines have a network connection for integrating the machine to the company’s own network. If the system is connected to the Internet on request our service engineers can log directly onto the machine and provide immediate support. With the possibility of remote maintenance service calls are drastically reduced which saves our customers time and costs.
Automatic Nozzle-Cleaning – Only a clean and oxidation-free solder nozzle can be wettable. With the integrated cleaning station the InterSelect cleaner is automatically sprayed onto the nozzle and oxidation residues are removed.
Automatic Solder-Wire-Feeder with Level-Sensor – A floater which is monitored by a laser sensor checks on the solder level. Once the level gets below a predetermined threshold, alloy is automatically added from an solder wire reel until the perfect level is reached again to ensure optimum soldering conditions.
Operating Data Logging – All InterSelect machines are equipped with multiple sensors monitoring every single feature of the system. The information that these sensors read are stored in an SQL database and can be automatically exported in XML format. By default the following parameters can be read: “Set” and “Actual” temperature of the solder alloy, “Set” and “Actual” temperature of the Preheaters or the printed circuit board directly (with pyrometer), proper flux application (with flux sensor) and of course error messages. More parameters can be added separately.
Barcode/QR-Code Reader – The integrated Barcode/QR-Code Reader scans the code on the PCB before the soldering starts and stores the ID in the database. In combination with the operating data logging all stored data can be assigned to the ID and exported in an XML-File. The Barcode/QR-Code Reader and operating data logging enables detailed „traceability“.
Pyrometer-controlled Preheat – During preheating, the temperature by means of a laser pyrometer is measured directly on the surface of the circuit board. The preheater is continuously adjusted accordingly until the set temperature is reached. Instead of tediously profiling the circuit board by adjusting time and heating power, with the pyrometer controlled closed-loop preheating the temperature is precisely attained. Overheating is prevented and at the same time it is guaranteed that the PCB reaches exactly the required temperature. Furthermore the preheating temperature of the PCB can be hold very accurately during the soldering process. Especially with long cycle times, without pyrometer controlled preheating the circuit board cools down very rapidly and the last solder joints may effectively soldered without preheat. The pyrometer preheating ensures consistent and reproducible quality of the solder joints.