RP 6 Reflow Soldering System RP 6 Reflow Soldering System
With the compact dimensions of the RP 6, a max.
PCB size of 300×200 mm and its low power consumption it is capable of sample manufacturing, manufacturing of small series or also component qualification.
The heating chamber is working with a mix of radiation heat by IR heaters and convection heat via radiators.Technical Specifications
548.04 Reflow Soldering System 548.04 Reflow Soldering System
Desk model with a grid belt conveyor.Technical Specifications
548.07 Reflow Soldering System 548.07 Reflow Soldering System
Desk model with a grid belt conveyor.Technical Specifications
548.10 Reflow Soldering System 548.10 Reflow Soldering System
Desk model with a pin chain conveyor or grid belt conveyor.Technical Specifications
549.30 B Stand alone 549.30 B Stand alone
Forced Convection & Heating Plates.Technical Specifications
7 ZCR Stand alone 7 ZCR Stand alone
Multizone Convection Reflow-System.Technical Specifications
551.10 and 551.20 Reflow soldering systems 551.10 and 551.20 Reflow soldering systems
The soldering system 551.10 is a new development made by SEF and combines the competence of more than 30 years in the manufacturing of reflow ovens with modern requirements regarding usability, low power consumption and interfaces for the communication with other devices.Technical Specifications