The soldering system 551.10 is a new development made by SEF and combines the competence of more than 30 years in the manufacturing of reflow ovens with modern requirements regarding usability, low power consumption and interfaces for the communication with other devices.

The basic system is designed as a desk top model and is equipped with eight heating zones, 4 upper and 4 bottom zones.The heating zones emit convection heat with the help of hot air fans. The upper part of the heating chamber contains additionally a cooling zone and an exhaust hood at the inlet area as well as at the outlet area.

The transport of the PCBs follows via a mesh belt. The operation of the soldering system is done with the help of a modern 7” touch panel. A 1-channel temperature profiler is integrated to check the soldering profile. The necessary thermocouple is included in the delivery.

The soldering system 551.19 offers higher production capacities but same technical functions. The modular system has a basic design with 20 zones (10 upper, 10 bottom), which can be used as heating zones or cooling zones individually, for example 8 heating zones and two cooling zones.

Technical data
Length: 3106 mm
Width: 850 mm
Height: incl. light pole 1432,50 mm
Weight: 474 kg
Usable working width: 405 mm
Active heating chamber
length: up to 2125 mm
Inlet height: 45 mm
Conveyor speed:15 cm/min – 90 cm/min
Heating power: max. 21 kW
Connection values: 3 x 230/400 VAC/N/PE 50 Hz with 32 A CEECON connector
Operation: 7“ Touchpanel